Facilities

With facilities strategically located in Asia’s key manufacturing hubs, VS today serves the EMS requirements for an ever-expanding international customer base.

V.S. International Group Limited
V.S. Industry Vietnam Joint Stock Company
V.S. Industry Berhad
V.S. Plus Sdn Bhd
V.S. Electronics Sdn Bhd
V.S. Technology Sdn Bhd
PT. VS Technology Indonesia

Tool Design and Fabrication

Our Group designs and fabricates various kind of tools for consumer electronics, home appliances, automobile and Information Technology (IT) Products. Our Group is staffed with technically competent professionals of vast designing / mould making experiences, equipped with latest CAD / CAM facilities and other sophisticated CNC machineries to meet customers’ requirements.

Injection Moulding

The Injection Moulding operation is equipped with the latest robotic pick-up arm and modern plastic injection moulding machineries. The state of art fully robotic moulding operation enables the company to provide top quality products and services to Multinational Companies (MNC). Our Group is committed to continuously upgrading its manufacturing technologies and facilities to position itself competitively in the industry. The Nitrogen Gas Assist Moulding and Overlay Moulding are some of the examples of modern plastic injection technology that you can find in our plants.

Sub Assembly

Our Group assembles high volume consumer electronics products, CD Mechanism and major components in the automobile industry. We have huge production capacity supported by modernised technologies and skilled people. Our Group has demonstrated excellent engineering and supply capability and is well prepared to advance into the production of high technology products.

PCB Assembly

To provide our customers with better service as well as strengthening our Group’s competitive edge in the electronic industry, the Group has ventured in Auto Insertion (AI), Surface Mount Technology (SMT) and Chip on Board (COB) operation. We are equipped with the latest range of machinery that handles surface mounting devices axial and radial leaded component and Chip On Board wire bonding.